Sonics Expands SMART Interconnect Adoption to
New Computing Paradigm
Toshiba Selects Sonics for Microprocessor “Cell” Companion Chip
MOUNTAIN VIEW, Calif., — Feb. 6, 2007 — Sonics Inc.®, a premier supplier of system-on-chip (SoC) SMART Interconnect™ solutions, today announces that Toshiba Corporation has selected Sonics’ SMART Interconnect solution and MemMax® memory scheduler as the foundation for their Super Companion Chip (SCC) for the microprocessor “Cell” that Toshiba jointly developed with IBM and Sony Group.
The adoption of Sonics’ SMART Interconnect solution into the computing paradigm led by “Cell” further validates the fundamental technical superiority of Sonics’ communications-based interconnect approach. This also extends the use of SMART Interconnect solutions across a new class of applications which are just emerging as the result of the adoption of “Cell” and its companion chips.
“The delivery of the SCC enables Toshiba to open many market opportunities for “Cell” based applications,” says Mr. Tomataka Saito, General Manager of the Broadband System LSI Division at Toshiba Corporation. “By selecting an interconnect-centric approach based on Sonics’ SMART Interconnect solutions, our engineers have achieved state-of-art design needed to keep “Cell” fed with streaming audio/video data and high bandwidth external connectivity. This approach has already enabled us to deliver a family of performance optimized SCC devices into high volume end markets.”
As first described in a technical paper at Hot Chips in 2005, the SCC leverages the unique end-to-end non-blocking flow control and advanced Quality of Service features of Sonics’ SMART Interconnect solution and MemMax memory scheduler to simultaneously decode multiple video streams at different levels of QoS and bandwidth. Toshiba’s decision is in line with an ongoing trend to adopt interconnect-centric or Platform SoC solutions in order to achieve both rapid integration and high reuse of key intellectual property components across multiple projects. Companies taking this approach are experiencing savings of time and money on a per project basis. Sonics SMART Interconnect solutions offer companies like Toshiba an economical and straight forward transition to the Platform SoC strategy.
About Sonics
Sonics Inc. is a premier supplier of SMART Interconnect solutions that deliver high SoC design predictability and increased design efficiency. With over 100 million units shipped, Sonics SMART Interconnect solutions have been used in some of the world’s leading-edge high-end SoCs, such as Texas Instruments’ OMAP application processors for cell phones, HDTV chips developed by Samsung for LCD-based HDTVs, as well as office automation and automotive video processing applications. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
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®Sonics Inc. and the company's logo are registered trademarks and SMART Interconnect and SMART Interconnects. All other trademarks are the property of their respective owners.
