The SonicsSX SMART Interconnect solution contains a high performance, advanced fabric and a comprehensive set of data flow services for the development of complex, multicore and multi-subsystem SoCs. By utilizing state-of-the-art physical structure design and advanced protocol management, SonicsSX can act as a local subsystem or global interconnect solution. For video data throughput acceleration, SonicsSX supports higher operating frequencies via an NoC fabric, data widths up to 256 bits and 2D transfers. SonicsSX achieve up to 16 Gigabytes per second throughput per port. As a global interconnect solution, SonicsSX also supports advanced leading edge, fine-grained power management, quality-of-service, access security, hardware monitoring/debug ports, and error handling features that facilitate higher design predictability and decrease chip development time. In addition, SonicsSX allows SoC developers to easily transition from single channel to multiple channel external DRAM memory architectures seamlessly and transparently to software and hardwired initiators.

This example SoC utilizes the flexible topology and multi-channel features of SonicsSX, while employing Sonics3220™ to partition slow speed peripherals, the Sonics MemMax® memory subsystem solutions to achieve high performance DRAM memory management and SonicsExpress™ to support clock and voltage domain isolation. This example utilizes IMT mutlichannel memory management capabilities for two channels of external DRAM which enables throughputs up to 16 Gbytes per sec per port to be achieved while implementing quality of service guarantees across the entire SoC. 

The SonicsStudio™ development environment supports SonicsSX by automating configuration, analyzing performance, and validating the system. SonicsSX is supported by the SonicsSXC SystemC model to accelerate examination of architectural trade-offs and allow applications software to be developed concurrent with hardware integration.