Sonics Defines SoC Interconnect Choices
New White Paper Offers Updated Information To Aid SoC Developers
MOUNTAIN VIEW, Calif., — June 4, 2006 — Sonics, Inc.®, the premier supplier of system-on-chip (SoC) SMART Interconnect™ solutions today announces the availability of a new white paper designed to help SoC developers better navigate the growing complexities associated with the SoC interconnect decision making process.
The new white paper defines three SoC interconnect choices. The first is a basic bus fabric which is typically delivered through EDA tools. It is relatively simple in structure and is typically used for cost-sensitive applications, such as microcontrollers and input/output protocol controllers. The second choice is an advanced fabric. These interconnects employ new innovations such as non-blocking architecture, and universal connectivity to any core using a myriad of protocols such as OCP, AMBA AHB and AXI. They are designed to better match requirements for applications such as automotive telematics and entertainment; digital set-top boxes; and wireless communications chip sets. The third interconnect choice contains an advanced bus fabric and data-flow services. Data-flow services further manage the interaction of the data between the processing elements on the SoC and external memory. High performance SoCs such as those targeted for HDTV or Smart phone applications, require these services in order to meet market requirements. Sonics offers quality of service, security and power management; as well as error and interrupt management, as part of the SonicsMX® SMART Interconnect solution.
“The convergence of video, voice, and data onto a single SoC has significantly raised the SoC architecture complexity, and countless new choices have surfaced that need to be sorted out in order to determine an SoC interconnect direction,” said Drew Wingard, chief technology officer, Sonics, Inc. “As the leader in the interconnect market, Sonics is offering updated definitions that help developers work through the key decision criteria to facilitate their SoC interconnect decisions.”
Sonics offers SMART Interconnect solutions that are upwardly compatible through the interconnect types. Companies that have a wide-range of SoC complexity requirements, perhaps spanning divisions, can preserve their entire corporate architecture and reuse investments using the Sonics compatible product line approach.
The new white paper is available from Sonics’ Web site at http://www.sonicsinc.com
About Sonics
Sonics, Inc. ® is the premier supplier of SMART InterconnectsTM solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics’ SMART Interconnects solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures, and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
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Sonics Inc. and the company's logo are registered trademarks and SMART Interconnects and Sonics3220 are trademarks of Sonics, Inc. All other trademarks are the property of their respective owners.
