Redesigned Sonics Web Site Provides Easier Navigation to
Corporate, Product And Design Information
MOUNTAIN VIEW, Calif., — June 13, 2006 — Sonics, Inc.®, the premier supplier of system-on-chip (SoC) SMART Interconnect™ solutions today announced a redesign of its Web site, www.sonicsinc.com, to reflect the increasing number of site visitors due to the consistent growth of the company and the widening use of its products.
Navigation improvements, including animation features on the home page, allow visitors to quickly access corporate information and data about Sonics products and partners.
The site also includes a new solutions section that provides system-level documentation such as white papers and presentations, to aid customers in the development of SoC designs. Clicking on “Mobile TV,” for example, gives customers interconnect design ideas for cell phone applications. Another new feature called “SonicsBLOGS,” will allow visitors to rapidly navigate to more precise information, such as new product details or new applications of Sonics products. They will also find executive viewpoints and announcements from Sonics’ partners.
“The goals of our redesign were to redistribute the valuable information the company has accumulated as it has grown , speed up access to that information using more modern methods such as a Blog, and to accommodate a much higher traffic volume which were are continually experiencing,” said Phil Casini, vice president of marketing for Sonics. “We believe our site visitors will be pleased with the changes we’ve made.”
About Sonics
Sonics, Inc. ® is the premier supplier of SMART InterconnectTM solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics’ SMART Interconnect solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures, and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
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Sonics Inc. and the company's logo are registered trademarks and SMART Interconnect and SMART Interconnects are trademarks of Sonics, Inc. All other trademarks are the property of their respective owners.
