SonicsSX SMART Interconnect Named to EDN Magazine’s
Hot 100 Products of 2008 List

MILPITAS, Calif., - Jan. 22, 2009 – Sonics, Inc., a premier supplier of system-on-chip SMART Interconnect solutions, today announced that its SonicsSX™ SMART Interconnect™ solution was chosen as one of EDN Magazine’s Hot 100 Products for 2008.  Selected by the editors of EDN Magazine, the products on the list are deemed to be the most significant technology announcements for the year.

Introduced in July 2008, SonicsSX, with Interleaved Multichannel Technology (IMT™), is designed for SoCs with the highest performance requirements. Customers are designing SoCs using this technology to optimize external memory bandwidth while easing integration of intellectual property cores and subsystems. Next generation high-quality, high-definition video subsystems benefit greatly from the capabilities and predictable performance offered by the SonicsSX solution.

With the addition of IMT, SoC architectures can seamlessly transition from one to multiple channels of DRAM, enabling higher memory bandwidth while enhancing memory efficiency by automatically balancing the traffic across the channels. IMT enables SonicsSX to manage multichannel memory systems inside the network-on-chip transparent to existing software, subsystems and/or IP cores. In addition, SonicsSX offers 2D data transaction support for video and graphics applications.

SonicsSX maximizes memory bandwidth to enable customers to target aggressive system cost points. This supports customers to implement higher operating frequencies, subsystem power management and other communication features that enable system optimization. SystemC modeling support enhances customers’ ability to deliver predictable results. As system complexity increases, SonicsSX enables SoCs, with higher operating frequency and expanded data width capabilities, to deliver the higher bandwidths supported by DDR3. This addresses the new challenges facing companies transitioning from DDR2 to DDR3 as well as those implementing higher-levels of SoC integration that stress memory throughput requirements.

“The Sonics team appreciates EDN’s recognition of our achievements,” said Drew Wingard, CTO at Sonics, Inc. “We believe that layering these new multichannel architecture features onto our existing production-proven technologies will aid designers by providing them cost and resource efficient approaches to deliver the required SoC performance without requiring additional software or core customization.”

About Sonics
Sonics, Inc. supplies critical semiconductor intellectual property for SoCs.  Its customers see the benefits of high design predictability and increased design efficiency.  Sonics solutions address the growing complexity found in consumer products with voice, data and video features.  Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba leverage Sonics’ technology in leading products in the wireless, digital multimedia and communications markets.  For more information, see www.sonicsinc.com.

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