SonicsWM Platform Solutions are a family of interconnect products designed to meet the challenging requirements of WiMax SoCs designs. Using an “interconnect centric” approach enables efficient communications among heterogeneous multi-processors and addresses the low power, high performance and low cost trends in the WiMax market.

By consolidating MAC communications inside the interconnect structure, SonicsWM enables chip developers to take a system wide view of the SoC architecture. This approach minimizes power and optimizes performance with minimum silicon area. In addition to performance parameters, SonicsWM addresses the critical need for a fast time to market given the growth of the WiMax industry. Having a unified interconnect structure enables rapid chip development by decoupling all cores for fast chip timing closure so that cores can be interchanged, removed, or added, in a modular fashion with minimal re-engineering.

Facilitating chip integration tasks SonicsWM, dramatically lowers risk, and increases predictability by providing developers with pre-verified system level services inside the interconnect. Market shifts can be accommodated with minimal impact to chip design schedules.

The SonicsStudio™ development environment helps SoC developers manage the highly configurable SonicsWM Platform Solutions. Configurations can be tuned to match performance, area, and power needs of any application while maintaining architectural consistency across the product line. RTL generated from SonicsStudio is ready for synthesis and layout. Alternatively, SystemC™ versions of the configuration can be outputted to enable software developers to model performance using a highly predictable data flow approach.